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Home arrow Wafer Processing arrow Articles arrow Edition 11 arrow 11th Edition: Low-k Dielectrics for Future IC Fabrication
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11th Edition: Low-k Dielectrics for Future IC Fabrication Print E-mail
Feb 03, 2005 at 03:59 PM

PETER SERMON, KNUT BEEKMANN AND SIMON MCCLATCHIE, Trikon Technologies Ltd., Newport, South Wales

ABSTRACT

New dielectric materials offering lower dielectric constants than silicon dioxide are needed for the manufacture of faster computer chips. In this article we survey the challenges involved in finding the right material.


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