|
11th Edition: MOCVD Processed Ceramic Thin Film Layers for Future Memory Applications |
|
|
|
Feb 03, 2005 at 03:54 PM |
|
MARCUS SCHUMACHER, JOHANNES LINDNER, PIOTR STRZYZEWSKI, MARTIN DAUELSBERG & HOLGER JUERGENSEN,
AIXTRON AG, Aachen, Germany ABSTRACT
MOCVD
processing of new materials such as perovskite type ceramic thin films
will be one of the major key technologies for a new semiconductor
device architecture in the field of ULSI non-volatile and volatile
memory applications. This article outlines general trends and
challenges in the field of MOCVD equipment and process development,
driven not only by material performance aspects but especially by new
integrated device applications like smart IC- and contactless RF-ID
cards.
 MOCVD Processed Ceramic Thin Film Layers for Future Memory Applications
|
Wafer Processing 