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Freescale joins IBM technology alliance |
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Jan 23, 2007 at 03:30 PM |
 Freescale Semiconductor has announced that future Silicon-on-Insulator (SOI) and standard CMOS process development work, beginning with the 45nm node, will be carried out within the IBM technology alliance that includes AMD, Chartered Semiconductor and Samsung amongst others.
"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale. "This industry-leading technology roadmap will enable Freescale to deliver substantial value to our customers."
Freescale plans to work with IBM on both low-power and high-performance technology research and development - the first to do so, according to Freescale. The R&D work is expected to continue through to the 22nm node, according to news reports.
The new partnership also includes semiconductor manufacturing via IBM's ‘Common Platform.' Freescale will have access to both IBM fabs and Chartered, both having facilities capable and experienced with SOI wafer processing.
"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Lisa Su, vice president, Semiconductor Research and Development, IBM. "Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless."
According to an EETimes story, Freescale will be leaving the Crolles2 Alliance at the end of 2007, following NXP, which announced its departure recently. However it seems that Freescale may continue small-scale production and prototyping at Crolles2, rather than make a complete break.
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