Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Materials & Gases arrow Air Products expands tungsten hexafluoride capacity due to semiconductor demand
Air Products expands tungsten hexafluoride capacity due to semiconductor demand Print E-mail
Jan 18, 2007 at 04:45 PM
ImageAir Products has announced the expansion of production capacity at its Hometown, PA specialty material manufacturing facility for the increased production of tungsten hexafluoride (WF6) used primarily to construct tungsten vias. The expansion will enable Air Products to produce 60 percent more WF6 for the semiconductor industry. The Company cited growth in memory chip manufacturing for the need to expand capacity.

"We forecast solid growth for WF6 and feel that the timing is right to add more capacity, and further extend our leadership in fluorine chemistry," said Corning Painter, vice president of Electronics for Air Products.

The new production unit is said to be an exact duplicate of Air Products' existing production capabilities, including all nickel construction with automated process systems and a proprietary distillation process to remove impurities, according to the company.
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
Air Products now producing 60 percent more tungsten due to memory demand  (15/11/2007)
Nitrogen supply for Samsung 300mm Austin fab now on-stream  (01/05/2007)
Air Products to add 500 metric tons of nitrogen trifluoride capacity  (12/02/2007)
Tool Order: Wafer suppliers place multiple RTP orders with Mattson  (16/05/2006)
TSMC selects Air Products for bulk gas delivery at Fab 14  (09/05/2006)

Related jobs
Process Engineers  (Balzers , 06/06/2008)
Regional Sales Director Europe (m/f) - Analog ICs  (Munich, 08/04/2008)
Manager, Facilities and Support Services  (PERRYSBURG, 19/03/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Site Director & GM  (South West UK, 06/03/2008)
Blog
Download
Subscribe
300mm