Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Cleanroom arrow News arrow Cleanroom arrow AMD starts tool install at new Bump & Test facility
AMD starts tool install at new Bump & Test facility Print E-mail
Jan 18, 2007 at 03:32 PM
ImageAMD has announced that it has completed the construction of its new Bump and Test facility, adjacent to Fab 30 in Dresden, Germany. Tool installation is now taking place in the 20,000m² building.

"At our Dresden site, we have gained extensive experience in precision planning and rapid implementation of large-scale projects," explained Dr. Hans Deppe, corporate vice president and general manager of AMD in Dresden. "However, I am amazed at the speed at which construction of the new clean room premises and supporting infrastructure has progressed."

The added capacity is designed to make more space available in both its front-end fabs at the same location as well as to handle the capacity ramps at Fab 36 and Fab 38, after completion of its conversion from a 200mm fab to a 300mm facility.

Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
Qimonda guides on 200mm fab reduction activities  (30/11/2007)
Top executive shuffles from Altis Semiconductor to AMD  (21/09/2006)
Top executive shuffles from Altis Semiconductor to AMD  (21/09/2006)
AMD chooses, wisely, to expand in Dresden  (30/05/2006)
AMD chooses, wisely, to expand in Dresden  (30/05/2006)

Related jobs
Director, Back End Equipment Engineering at DayStar Technologies  (Newark, 18/07/2008)
Engineering Project Manager  (Alzenau, 28/03/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Site Director & GM  (South West UK, 06/03/2008)
Customer Engineer  (, 04/03/2008)
Download
300mm