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UMC breaks ground on $5 billion 300mm fab |
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Jan 08, 2007 at 01:51 PM |
 UMC has started construction of its third 300mm fab at an estimated cost of $5 billion US Dollars, the company has said in a press statement. The new fab will be located in Taiwan's Tainan Science Park, adjacent to its existing 300mm facility, Fab 12A. UMC has another 300mm facility in Singapore. The new fab is expected to have a capacity of 50,000 wafer starts per month and is expected to be completed by the end of 2007. First phase tool install is expected in the first quarter of 2008.
"UMC remains strongly committed to continuing its growth and development in Taiwan," stated Dr. Jackson Hu, chairman and CEO of UMC. "The Tainan Science Park Fab 12A began production in 2000 as Taiwan's first 300mm fab, while the new fab's construction begins as our new R&D headquarters is being completed. The close proximity of the R&D center to the fabs will allow for the seamless integration of advanced process technologies from the R&D phase to manufacturing, such as the company's 45nm process technology that was recently used to fabricate working SRAM chips," noted Hu.
UMC's new R&D facility is also entering its final stages of construction, which is scheduled for completion in March, according to the company.
UMC Fab 12A
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