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Tool Order: NSTR of Japan to use Bede x-ray system for buried crystallographic defect inspection |
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Dec 06, 2006 at 09:27 AM |
 Nippon Steel Technoresearch Corporation (NSTR) has selected Bede X-ray Metrology's ‘BedeScan' Defect Detection and Inspection System to look at surface and buried crystallographic defects in Silicon and Silicon Carbide wafers. The system will be shipped in December 2006.
"We chose the BedeScan system because of its ability to provide high resolution images of crucial defects in semiconductor wafers," stated Tomiyoshi Masuda, President, NSTR. "The advantage of the BedeScan is that it allows us to better visualize buried defects in wafers, as well as those on the surface. Such defects may go undetected with traditional inspection methods that have been used in the past. In addition, the system also allows us to look at new classes of wafer edge defects, which can lead to device failure. The BedeScan will be a worthwhile investment for both us and our customers."
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