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Japanese wafer suppliers beta test 45nm defect inspection with KLA-Tencor |
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Dec 05, 2006 at 02:57 PM |
 Shin-Etsu Handotai, Ltd. (SEH) and SUMCO Corporation (SUMCO) are beta-system partners with KLA-Tencor for un-patterned wafer inspection technology using the Surfscan SP2 platform that is expected to be used at the 45nm node.
"As chipmaking moves to 45nm, wafer defects that were barely detectable in earlier generations are becoming yield killers, and wafer suppliers must be able to quickly distinguish between defects that can be reworked and those that cause rejection of an entire wafer," said Mike Kirk, group vice president of KLA-Tencor's Wafer Inspection Group.
Katsuhiko Miki, General Manager of the SEH Technology and Development Division, said, "Providing defect-free wafers to our customers requires greater quality control with every new chip generation, both to develop more advanced wafer manufacturing processes and to ship superior quality final products."
"KLA-Tencor's inspection and yield knowledge is one of the key elements in overcoming the defect challenges at 45nm and below," stated Etsuro Morita, General Manager of SUMCO Production and Technology Division.
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