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11th Edition: Semiconductor FAB Automation Capabilities Management: An Express Route |
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Feb 03, 2005 at 02:40 PM |
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TOM HOGEL & LES MARSHALL, TRW Inc., Austin, TX, USA ABSTRACT
Traditional
capital equipment procurement practices in the semiconductor industry
usually rely upon suppliers to deliver what they have promised in their
quotation, with "automation" needs naturally appearing way down the
list in terms of priorities. Actual tool automation capabilities and
limitations are not "discovered" until the Equipment Interface (E.I.)
characterisation phase, when there is little or no leverage available
to coerce tool suppliers into correcting automation deficiencies.
The
consequential effects of this standard procurement methodology are not
only to delay such discovery, but to necessitate costly and
time-consuming E.I. customisation effort, thereby further delaying the
point at which full automation can be achieved. The use of "Automation
Capabilities Management" or ACM techniques decreases variance in tool
automation functionality, enabling earlier E.I. deployment and reduced
E.I. life cycle costs together with a more rapid production ramp.
 Semiconductor FAB Automation Capabilities Management
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Wafer Processing 
