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New Product: Copper ECD filter from Entegris guards against acid reaction |
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Nov 07, 2006 at 03:45 PM |
 Product Briefing Outline: Entegris Inc. has introduced the new ‘Guardian' family of high-flow cartridge filters that are designed to be non-reactive to a wide range of plating additives and provide higher levels of particle retention as well as longer life. Guardian ECD filter cartridges are applicable to high-purity electrochemical deposition processes, such as copper, nickel, and gold plating.
Problem: Conventional electroplating chemical solution cartridge filters can react with acid-based solutions causing increased particle contamination within the chemical bath and generate potential yield loss on the processed wafer. Cartridge filters by design can cause micro-bubble formation during flow sequences within the bath, which have been shown to contribute to wafer defect formation.
Solution: Guardian ECD filters use an optimized membrane pore structure and feature proprietary polyethersulfone (PES) membranes that will not react to a variety of plating bath additives, eliminating effects that can compromise process quality. The design ensures high bath turnover to deliver rapid particle removal to minimize process start-up time, according to the company. Because the cartridge contains a high filter area, Guardian ECD provides a longer service life while maintaining optimal bath filtration properties. The unique hydrophilic membrane reduces the occurrence of micro-bubble formation during wafer processing.
Applications: Electrochemical deposition processes, such as copper, nickel, and gold plating.
Platform: The Guardian ECD filter cartridge, which is available in 0.1µm-0.05µm pore sizes, are compatible with most housings, are quick to install, and do not require any pre-wetting or flushing procedures for quick startups. The high filter area and optimized flow design also help extend service life and reduce downtime associated with replacement. The filters offer a maximum operating temperature range to 60ºC (140ºF).
Availability: November 2006 onwards.
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Product Briefings 
