|
12th Edition: ECD Seed Layer for Inlaid Copper Metallisation |
|
|
|
Feb 03, 2005 at 01:58 PM |
L. CHEN & TOM RITZDORF, Semitool Inc.Kalispell, Montana, USA and HEN & TOM RITZDORF, Semitool Inc., Kalispell, Montana, USA
ABSTRACT
A novel approach is presented in this paper for inlaid copper
metallisation. Contrary to the traditional approach regarding seed
layer application, an ultra-thin copper flash layer, serving as an
adhesion layer, is deposited by a PVD process. This flash adhesion
layer is conformally enhanced from Semitool's specially formulated
plating solutions by electroplating. The ECD seed layer is then used as
a base for copper deposition from an acid copper sulfate plating bath.
The advantage of depositing an ultra-thin copper flash adhesion layer
and ECD seed layer, rather than a relatively thick PVD copper seed
layer, is that pinching off of small trenches or vias can be avoided,
while ensuring adequate sidewall coverage.
 ECD Seed Layer for Inlaid Copper Metallisation
|
Wafer Processing 