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Home arrow Wafer Processing arrow Articles arrow Edition 12 arrow 12th Edition: Lower Equipment Cost of Ownership Through Spa...
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12th Edition: Lower Equipment Cost of Ownership Through Spare- Parts-Management Programmes Print E-mail
Feb 03, 2005 at 12:16 PM

ROBERT B. HIXSON, Integrated Device Technology, Hillsboro, OR, USA
PETER N. SWEETNAM, Semiconductor Equipment Technology, Inc., Dublin, CA, USA

ABSTRACT

Through the use of a parts management programme, Integrated Device Technology (IDT) has been able to reduce its equipment cost of ownership. The key aspects are: establishing an alternative source of parts; inspecting recycled parts to critical dimensions; tracking of recycled parts; pre-assembling kits where possible; custom-designing parts and surface finishes to address specific process requirements; and partnering with a supplier. While this article focuses on spare-parts management for physical vapour deposition (PVD), the approach is relevant to almost all other equipment sets as well.


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