Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Wafer Processing arrow Articles arrow Edition 12 arrow 12th Edition: Application of Advances in Reactor Design to ...
Flash Banner
12th Edition: Application of Advances in Reactor Design to Metal Etch Chambers for Availability Print E-mail
Feb 03, 2005 at 12:13 PM

DAVE GALLEY, WILLIE FUNK & MARY JANE EVANS, ATMEL Corporation, Colorado Springs, CO, USA
KEVIN SANNES, Applied Materials, Colarado Springs, CO, USA
JOHN O'SULLIVAN & DEREK BRODIE, Applied Materials, Sunnyvale, CA, USA

ABSTRACT

Utilising concepts of advanced reactor design, a team from ATMEL and Applied Materials has adapted the MxP metal etch reactor to successfully meet the demands of a high-volume manufacturing environment. Liner technology, an electrostatic chuck and a self-cleaning focus ring have been employed to bring the system availability from a highly variable ~58% to a very consistent mean of ~87%. Particle performance has dramatically improved without sacrificing process performance.


icon Application of Advances in Reactor Design to Metal Etch Chambers for Availability, Cost, Process

Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
11th Edition: A Novel Dual-Damascene ETCH Process Utilising a High-Selectivity, Ultralow-k  (03/02/2005)
11th Edition: A Breakthrough in Low-k Barrier/Etch Stop Films for Copper Damascene Applications  (03/02/2005)
11th Edition: The Importance of Cu in New Generation Process Technologies  (03/02/2005)
14th Edition: The SiGe:C Epitaxy Process in Manufacturing  (02/02/2005)
15th Edition: Innovative Metal Lift-Off Process Using Dry Carbon Dioxide1  (02/02/2005)

Related jobs
Senior Etch Process Engineer  (Wales, 19/03/2008)
Staff Process Engineer  (Portland, 22/11/2007)
Etch Development Engineer  (Portland, 22/11/2007)
Systems Engineer II  (Santa Clara, 17/09/2007)
Lead Mechanical Engineer  (Peabody, 10/08/2007)
300mm