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Home arrow News arrow Wafer Processing arrow TSMC joins IMEC’s Europractice
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TSMC joins IMEC’s Europractice Print E-mail
Oct 13, 2006 at 12:28 PM
ImageTSMC has followed UMC's long since move to allow European based fabless start-ups and other very small scale operations to gain access to foundry processes via IMEC's Europractice prototyping services.

Europractice will now be offering TSMC's 250nm, 180nm and 130nm CMOS general-purpose technologies via TSMC's ‘Cybershuttle' Multi Project Wafer (MPW) platform.

"Partnering with IMEC is an important step in TSMC's on-going effort to support and to grow the European fabless semiconductor industry. By combining TSMC's technology and manufacturing services with IMEC's engineering, logistics and supply chain resources, European fabless semiconductor companies gain access to a secure supply for low volume or early phase production. We are very impressed with the efficiency and professionalism with which IMEC handles this new service, and we look forward to a long and successful partnership with IMEC and its customers." said Kees den Otter, president, TSMC Europe.

UMC's long-standing shuttle service and processes through Europractice are not affected by the TSMC announcement. According to IMEC, the services will remain independent of each other and are customer/foundry specific.

TSMC's move to offer small customers this service comes on the back of the foundry's close collaboration with IMEC on 32nm CMOS research. TSMC is a ‘core' partner in the program.


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