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New Product: GAMMA Express dry strip system from Novellus tackles sub 65nm resist removal |
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Sep 25, 2006 at 01:59 PM |
 Product Briefing Outline: Novellus Systems has launched its newest line of ‘GAMMA Express' dry photoresist dry strip high dose implant strip (HDIS) systems for 300mm wafer processing. A single product platform for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications, GAMMA Express is claimed to provide the highest levels of technology, reliability and productivity for bulk strip and HDIS at the 65nm and 45nm nodes. The system is currently in beta evaluation with a large memory manufacturer in Asia, according to the company.
Problem: New materials and processes required for advanced node
IC devices put increasing pressure on dry strip technology to offer
no-plasma induced damage. Importantly, post-strip residue needs to be
minimal to prevent the use of complex wet clean steps. With HDIS it is
important to limit resist flaking or have implant or sputtered oxide
residue. Temperature control is also crucial to prevent resist popping
at elevated temperatures.
Solution: The system includes low silicon loss implant strip and
non-oxidizing strip chemistries for compatibility with advanced
Silicide and ultra low-k films, in addition to support for conventional
bulk strip, HDIS, and C4 packaging applications. This application
diversity is enabled by five active RF stations and a tailored
Universal Gas Distribution system. Single digit particle performance
with all minimum contact area (MCA) components, including load locks
with MCA cassette, ceramic MCA blades, spindle with MCA fingers, and
process, over-ash and preheat pedestals, help customers repeatedly
achieve lower defectivity, according to the company.
Applications: Bulk strip and high dose implant strip (HDIS) at the 65nm and 45nm nodes.
Platform: High composite productivity, with more than 300 wph
for bulk strip and 150 wph for HDIS, is driven by a new proprietary
source technology combined with Novellus' Multi-Station Sequential
Processing (MSSP) architecture. High system availability - with short
mean time off line (MTOL) and high mean time between failures (MTBF) -
enabled by state-of-the-art direct drive wafer handling, a new open
frame architecture for easier serviceability, are additional features
claimed by the company.
Availability: July 2006 onwards.
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Wafer Processing 
