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Home arrow Materials & Gases arrow News arrow Materials & Gases arrow ATMI establishes copper technology center in Hsinchu, T...
ATMI establishes copper technology center in Hsinchu, Taiwan Print E-mail
Sep 20, 2006 at 03:23 PM

ImageATMI has announced that it has officially opened its first major Asia Technology Development Center based in Hsinchu, Taiwan. The new facility is intended, according to the company, to provide technical, analytical, testing, and consulting services to ATMI customers that implement advanced copper processes.

George Yang, General Manager of ATMI's Asia Operations said, "Now ATMI's Asia customers have local and regional technical and product development, and analytical support for our advanced copper-related materials. We are able to tailor chemistry formulations, conduct tests, and give our customers expert local materials and process efficiency support for their most advanced sub-90 nanometer and 300mm processes. The Center will reflect ATMI's approach of developing solutions that are practical and that reduce the overall costs of the manufacturing process."

The new facility features 1,500 square feet (140 square meters) of Class 10 and Class 100 cleanroom space with 300mm process tools and 9,000 square feet (850 square meters) of analytical laboratories. Advanced metrology systems have also been installed, such as their scanning electron microscope and high performance liquid chromatography equipment.

"Asia presents the strongest growth prospects for the semiconductor industry and for ATMI because of the continued rapid expansion of the chipmaking foundries," stated Doug Neugold, ATMI Chief Executive Officer. "Our investment in the new Asia Technology Development Center reflects our dedication to supporting ATMI's key customers around the globe and provides more opportunities to demonstrate the process efficiency benefits of ATMI's semiconductor materials and solutions."

With memory chip manufacturers starting to replace aluminum with copper for interconnects and foundries migrating to 65nm processes, copper based processing technology is becoming increasingly customized to customer requirements and specific to particular devices. With time to market and yield related issues becoming increasingly critical, faster response and process support from vendors is required.

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