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New Product: Electroplated metals abatement from BOC Edwards manages waste |
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Sep 19, 2006 at 06:14 PM |
 Product Briefing Outline: BOC Edwards has launched a new ‘EPMA'(electroplated metals abatement system) product, which offers simplified liquid waste treatment and lower cost of ownership than conventional approaches.
The first system has been installed and is operational in a major US
electronics manufacturing facility where it processes metal laden waste
streams from both CMP and multiple plating operations in a single
integrated process.
Problem: Metallization steps for semiconductor, MRAM, disk platen, and
disk head manufacturing produce large volumes of dilute waste with
relatively low concentrations of metals including copper, nickel,
cobalt and iron. These wastes are produced by post-plating rinse and by
planarization steps. Metal ions in effluent streams are biocides:
chemical agents capable of destroying living organisms, which have
strict government regulated discharge limits. These plating processes
generate large volumes of dilute metal-contaminated wastewater and may
also contain hydrogen-evolving reactants that create a localized and
accumulative safety hazard. Most of the metals are regulated and must
be removed before the liquid waste can be discharged. However, the
large volumes and dilute concentrations make traditional treatment
methods, such as precipitation, economically less viable.
Solution: Unlike traditional methods that involve either transporting
large volumes of material for off-site processing or managing multiple
precipitation based processes, and the solid waste that they create,
EPMA greatly simplifies the task of managing waste from electrochemical
deposition processes. The EPMA system removes metals from both CMP and
plating rinse streams, discharging a final effluent with very low
metals concentrations, and producing a highly concentrated metal
bearing waste. The system combines a novel fluidized bed ion exchange
system and a multiple stage nano-filtration unit, such that waste
volumes are reduced by factors of 1,000 to 1 or more, and metals in the
concentrated waste exceed 20,000 ppm.
Applications: Metallization steps for semiconductor, MRAM, disk platen, and disk head manufacturing
Platform: Available in 2-, 10- and 100-gpm facility configurations based on a modular, expandable package.
Availability: July 2006 onwards.
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Product Briefings 
