Taiwan Semiconductor Manufacturing Company (TSMC) has chosen to use Timbre Technologies' (a Tokyo Electron subsidiary) Optical Digital Profilometry - Mask (ODP-M) CD and profile metrology technology for development of advanced 32nm phase-shift masks at its captive mask shop in Taiwan. The technology is being used in conjunction with the Atlas-M Advanced CD and thin-film tool from Nanometrics, the company stated.

"The adoption of the ODP-M solution for mask applications by TSMC signifies broad industry acceptance of the ODP technology. It has now been successfully implemented at key mask shops worldwide," said Dr. Sanjay Yedur, ODP Product Manager. "ODP technology is now available as a fab-wide solution, from front-end mask applications through back end wafer processing. For our customers, this provides a reliable and consistent metrology solution through the complete manufacturing process."

Based on optical scatterometry, ODP-M translates diffracted broadband light into accurate physical profiles of mask structures, etch depths and underlying film thicknesses.