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Order Win: Hynix converts 300mm fab furnaces to IM’s SiFusion furnaceware |
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Sep 14, 2006 at 05:57 PM |
 Hynix Semiconductor has replaced existing thermal furnace quartzware at its M5 300mm fab in Ichon, Korea with Integrated Materials Inc's pure poly silicon ‘SiFusion' replacements parts. The changeover occurred after a qualification testing program that included competitor's product offerings revealed significant cost savings compared to alternative solutions, according to the company.
"After testing the SiFusion 300mm boats, it is clear that these boats are easily integrated into our system," stated a Senior Engineering Manager at Hynix Semiconductor (not named), according to IM's press release. "In addition, we saw increased tool uptime and improved process performance which allows Hynix to increase production of the latest memory products that our customers seek."
"We are excited to provide Hynix with the furnaceware it needs to realize more effective furnace utilization and superior process performance," said Tom Cadwell, president and CEO of Integrated Materials. "SiFusion furnaceware opens the door for higher throughput, lower costs and easier process migration to next-generation 65-nanometer and 45-nanometer designs."
Integrated Materials Inc has also announced that it has become the ‘Tool of Record' at a 300mm fab located in the US for oxide anneal process, and uses SiFusion high temperature, long finger boats for 90nm devices, according to the company.
Two Asian based fabs (one of which is Hynix) are now migrating to the pure poly silicon furnaceware. An additional Asian fab is actively working toward qualification, the company stated.
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