Online information source for semiconductor professionals

The Impact of the Architectural Design on the Constructibility and the Evolution of a Fab

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

ALFONSO MERCURIO, AMA Group, Rome, Italy & Singapore

ABSTRACT

The principal objective when designing a wafer fab is the creation of an effective architectural solution, with limited costs and easy construction, offering the simple and practical answer to a complex problem. This involves the compatible arrangement of highly specialised plant engineering, taking into consideration the diverse dimensions and quality of the various spaces, while guaranteeing flexibility to a structure which must undergo repeated technological modifications. Furthermore, the large size of these complexes means that they have a major impact on the urban and suburban setting, and consequently they represent the production philosophy and economic status of a company.
Download Please login to download the paper. No account yet? Please register. It's free!

Related jobs

Semiconductor Photo Line Maintenance Technician - AMI Semiconductor - Pocatello, 02 October 2007

Analog Design Engineer - AMI Semiconductor - Sunnyvale, 10 August 2007

Technical Support Engineer - Carl Zeiss SMT, Inc. - Peabody, 10 August 2007

Electrical engineering - Axcelis - Beverly, 10 August 2007

Senior Applications Engineer - Axcelis - Beverly, 09 August 2007

Related articles

MIPS Technologies teams with Portuguese University to offer design training - 28 April 2008

Value of an Optimized Test System for Advanced IC Design Validation, Characterization and Failure .. - 01 December 1999

IBM’s SiGe BiCMOS technology roadmap - 01 September 2003

GSMC – Quality first in the PRC - 01 September 2003

APCVD TEOS: O3 Advanced Trench Isolation Applications - 01 March 1999

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: