Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Lithography arrow Buried EUV mask blank defects now detectible
Buried EUV mask blank defects now detectible Print E-mail
Sep 06, 2006 at 02:06 PM
Defects now detectible Within the European Commission funded research project ‘More Moore' that is looking at a range of EUVL challenges a small team of scientist from Focus GmbH and two German universities, Bielefeld and Mainz have announced that they have been able to identify buried defects as small as 50nm under the multilayer coating of an EUV mask blank.

Advanced TEM/SEM and other inspection techniques have been unable to detect such small defects found below the surface layer prompting work on photoemission electron microscope (PEEM), whose analytical performance is principally superior to current techniques.

"The European funding is an excellent support of our R&D activities and we are pleased that we could achieve such an important result," says Michael Merkel, Managing Director of FOCUS.

The PEEM system has been able to measure features as small as 20nm, importantly without destroying the sample, opening up its use for EUV mask blank inspection work.


Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
New Product: Wafer Plane Inspection technology from KLA-Tencor addresses 32nm mask defect challenges  (14/04/2008)
New Product: Wafer Plane Inspection technology from KLA-Tencor addresses 32nm mask defect challenges  (14/04/2008)
SEMATECH successful in removing 10nm particles from EUV mask blanks  (12/04/2007)
Tool Order: NSTR of Japan to use Bede x-ray system for buried crystallographic defect inspection  (06/12/2006)
EUV mask blanks reach pilot-line defect levels  (14/02/2006)

Related jobs
Regional Sales Director Europe (m/f) - Analog ICs  (Munich, 08/04/2008)
Manager, Facilities and Support Services  (PERRYSBURG, 19/03/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Application Engineer  (Perrysburg, 13/03/2008)
Technical Program Manager  (Alzenau , 04/03/2008)
Subscribe
300mm