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New Product: Closed-loop digital ionization sensor from MKS Instruments handles static issues in EFE |
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Aug 29, 2006 at 06:47 PM |
 Product Briefing Outline: MKS Instruments has introduced the Ion Systems Model 5200-SR Digital Ionization Sensor for use in semiconductor equipment front end modules (EFEMs) or in process modules, due to its small footprint.
Problem: Static can be generated within the EFEM or process tool module that can affect and damage 300mm wafers. Without a closed-loop constant monitoring sensor it is difficult to gauge ionization levels or judge when best to carry out preventative maintenance.
Solution: The Sensor Model 5200-SR operates with the Digital AeroBar Model 5225 and Interface Module Model IM6T to create a complete ionization system. The Digital AeroBar Model 5225 system is claimed to be the most sophisticated ionization system available, with parameters that are adjustable to be as detailed and customized as you need. The Sensor enhances the system by monitoring ionization performance in closed environments and automatically adjusting ionization output based on the data. Closed loop control enables 45nm and 65nm process control. The Model 5200-SR Sensor is the only product of its kind to create this closed-loop ionization system, according to the company. Wafers are always safe from static because ionization performance is constantly monitored. Tools calibrated to compliance with industry guidelines, such as SEMI E78, stay within the target. Ionizers perform in top condition because Sensor feedback indicates when preventative maintenance (PM) is necessary.
Applications: Front end modules (EFEMs) or in process tool modules. Closed loop control enables 45nm and 65nm process control.
Platform: The 5200-SR Digital Sensor, combined with AeroBar ionizers and integrated IonMonitor™ software, providing closed-loop controlled ionization system. This guarantees that tool calibrations remain in compliance with industry guidelines such as SEMI E78. Compliance with E78 improves yield by minimizing particle attraction to wafers, as well as eliminating ESD damage during wafer handling, according to the company.
Availability: July 2006 onwards.
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Product Briefings 
