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New Product: Nova offers 2D/3D modeling on high throughput NovaScan 3090Next platform |
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Aug 29, 2006 at 03:22 PM |
 Product Briefing Outline: Nova Measuring Instruments has launched the next generation of its NovaScan metrology systems, the ‘NovaScan 3090Next' series. The stand-alone metrology system provides improved topography modeling, faster throughput and excellent matching between tools and fabs, according to the company. This is done through implementation of polarized normal-incidence spectroscopic scatterometry, with an extended ultraviolet and infrared spectral range, for measuring the thickness and topography of thin films widely used in semiconductor manufacturing.
Problem: As 65nm technology, complex materials, structures and layer stacks, 300mm applications, process tool performance envelope and other advances become more prevalent, accurate measurement and process control become both more important and more complex. Since some new and emerging processes can negatively impact time to yield, cycle time, or overall equipment and fab efficiency, tight process control is no longer merely valuable, but essential. This means that access to meaningful data on process and tool performances must be available to both process owners and equipment owners across the full array of applications and a varied list that includes CVD, CMP, copper/low-k, Etch and Lithography.
Solution: The NovaScan 3090Next SA provides utilizes polarized normal incidence spectroscopic scatterometry with an extended UV and IR spectral range. This leading-edge tool brings unprecedented capabilities to the metrology industry. A key aspect is its new 2D/3D modeling functions that allows the modeling of any desired shape, which identically match, not approximate, what is really on the wafer. Nova's hardware and software are optimized to work in unison for tighter correlation. The system has a claimed throughput of 150 wafers per hour with a single metrology module. With this high throughput rate, the NovaScan 3090Next-SA can support higher sampling rates, while allowing it to keep up with high throughput process tools such as photolithography tracks.
Applications: Full pattern profiling in 2D/3D with multiple critical dimensions measurements, as well as thickness measurement of Dielectric, Poly-silicon and very thin conducting layers, on either multi-layer stacks, on silicon or metal stacks.
Platform: The NovaScan 3090Next SA metrology module is identical in design and performance to NovaScan 3090Next IM modules used in the CMP and Etch sectors. This approach ensures the best solution for HVM environments, where SA and IM systems are working together, and where tool-to-tool matching and recipe transportability are essential. At the same time, this also provides for excellent fleet matching performance between various fab sites.
Availability: July 2006 onwards.
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Wafer Processing 
