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New Product: Carl Zeiss SMT and SII Nano’s XVision 300 creates 3D defect analysis at the nano range |
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Aug 21, 2006 at 11:34 AM |
 Product Briefing Outline: Carl Zeiss SMT's Nano
Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology
Inc. (SIINT) have jointly introduced the XVision 300 Focused Ion Beam
(FIB)/Scanning Electron Microscope (SEM) hybrid system. The XVision 300
is designed to enable ultra-high resolution, 3-dimensional surface and
sub-surface process inspection and defect analysis on 300mm wafers at
the 65/ 45nm node and beyond. The workstation, enables for dissection
of high quality TEM lamellas from anywhere on a 300mm wafer. This is
the first jointly developed product emerging out of the strategic
alliance between the two respective companies earlier in 2006.
Problem: Carl Zeiss NTS' ‘GEMINI'SEM technology allows
for ultra-high-precision control of the FIB cutting process during FIB
operation in real time. This unique capability allows for highest
precision FIB cuts of sub-surface sample features and defects, thereby
substantially easing the overall tool operation and reducing time to
result for high-throughput defect inspection, analysis and sample
preparation for further analysis.
Solution:
A new process feature offered by the XVision 300 is the application of
a low-energy Gallium ion beam during final FIB polishing, which reduces
any sample surface damage occurring during preparation of lamellas for
transmission electron microscopy (TEM) to the demands of close-to
atomic resolution TEM requirements. An additional low-energy Argon ion
beam column (Triple Beam concept) can be installed on the XVision 300
series for additional removal of amorphous surface layers, thereby
achieving TEM lamella quality for quantitative atomic resolution TEM
characterization. The newly designed SIINT FIB ion optics offers high
beam current for almost doubling the throughput compared to
conventional FIB systems the companies claim. The system is intended to
offer a seamless support for full process control workflow ranging from
high-rate abrasive Gallium FIB milling to Argon-based FIB fine
polishing to final end-point detection by high resolution SEM imaging
during ion milling and polishing.
Applications:
XVision 300 offers process automation and data analysis capabilities at
minimum operator interaction, comprising a wide variety of automated
functions and programs such as its multiple-site TEM lamella
preparation software (A-TEM). Futher options include the even-distance
cross-sectioning program, a highly accurate 3D image reconstruction
capabilities for in-depth 3D feature analysis and a fully automated
cross-section image acquisition software (Auto Cut & See). Auto Cut
& See function, allows the operator to create a process recipe in
advance of the actual operation and enables for unattended acquisition
of multiple sample sites in terms of automated FIB cross sectioning and
auto-focus image recording. This feature supports users in periodically
and frequently revisiting critical wafer sites in a fully automated and
controlled manner.
Platform: Based on an
automated 300mm Double Beam/ Triple Beam platform, the XVision 300
combines the ultra-high-resolution GEMINI® SEM imaging capabilities
from Carl Zeiss NTS with ultra-high precision and high current FIB
cutting capabilities from SIINT. Inheriting numerous automated and
user-centric functionalities for nano-scale analysis, metrology and
materials characterization, the XVision 300 represents an unprecedented
versatile workstation. Thus XVision 300 enables both, cleanroom process
monitoring as well as wafer-level defect root cause analysis in
laboratory environments.
Availability: July 2006 onwards.
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Product Briefings 
