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New Product: Carl Zeiss SMT and SII Nano’s XVision 300 creates 3D defect analysis at the nano range |
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Aug 21, 2006 at 11:24 AM |
 Product Briefing Outline: Carl Zeiss SMT's Nano Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology Inc. (SIINT) have jointly introduced the XVision 300 Focused Ion Beam (FIB)/Scanning Electron Microscope (SEM) hybrid system. The XVision 300 is designed to enable ultra-high resolution, 3-dimensional surface and sub-surface process inspection and defect analysis on 300mm wafers at the 65/ 45nm node and beyond. The workstation, enables for dissection of high quality TEM lamellas from anywhere on a 300mm wafer. This is the first jointly developed product emerging out of the strategic alliance between the two respective companies earlier in 2006.
Problem: Carl Zeiss NTS' ‘GEMINI'SEM technology allows for ultra-high-precision control of the FIB cutting process during FIB operation in real time. This unique capability allows for highest precision FIB cuts of sub-surface sample features and defects, thereby substantially easing the overall tool operation and reducing time to result for high-throughput defect inspection, analysis and sample preparation for further analysis.
Solution: A new process feature offered by the XVision 300 is the application of a low-energy Gallium ion beam during final FIB polishing, which reduces any sample surface damage occurring during preparation of lamellas for transmission electron microscopy (TEM) to the demands of close-to atomic resolution TEM requirements. An additional low-energy Argon ion beam column (Triple Beam concept) can be installed on the XVision 300 series for additional removal of amorphous surface layers, thereby achieving TEM lamella quality for quantitative atomic resolution TEM characterization. The newly designed SIINT FIB ion optics offers high beam current for almost doubling the throughput compared to conventional FIB systems the companies claim. The system is intended to offer a seamless support for full process control workflow ranging from high-rate abrasive Gallium FIB milling to Argon-based FIB fine polishing to final end-point detection by high resolution SEM imaging during ion milling and polishing.
Applications: XVision 300 offers process automation and data analysis capabilities at minimum operator interaction, comprising a wide variety of automated functions and programs such as its multiple-site TEM lamella preparation software (A-TEM). Futher options include the even-distance cross-sectioning program, a highly accurate 3D image reconstruction capabilities for in-depth 3D feature analysis and a fully automated cross-section image acquisition software (Auto Cut & See). Auto Cut & See function, allows the operator to create a process recipe in advance of the actual operation and enables for unattended acquisition of multiple sample sites in terms of automated FIB cross sectioning and auto-focus image recording. This feature supports users in periodically and frequently revisiting critical wafer sites in a fully automated and controlled manner.
Platform: Based on an automated 300mm Double Beam/ Triple Beam platform, the XVision 300 combines the ultra-high-resolution GEMINI® SEM imaging capabilities from Carl Zeiss NTS with ultra-high precision and high current FIB cutting capabilities from SIINT. Inheriting numerous automated and user-centric functionalities for nano-scale analysis, metrology and materials characterization, the XVision 300 represents an unprecedented versatile workstation. Thus XVision 300 enables both, cleanroom process monitoring as well as wafer-level defect root cause analysis in laboratory environments.
Availability: July 2006 onwards.
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Wafer Processing 