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Home arrow Wafer Processing arrow Articles arrow Edition 14 arrow 14th Edition: A New Advanced System for Defect Identificati...
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14th Edition: A New Advanced System for Defect Identification on Unpatterned Wafers Print E-mail
Feb 03, 2005 at 09:17 AM

PETER-M. HEINZE, Macrotron Systems GmbH, München, Germany

ABSTRACT

A defect detection tool utilising multiple beams at different wavelengths has been developed and acquired a proven track record in wafer fab utilities in Japan. The history of the development and the performance of the tool is described and its advantages over the conventional defect detector discussed.


icon A New Advanced System for Defect Identification on Unpatterned Wafers: the WM-3000 FOUP
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