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A New Advanced System for Defect Identification on Unpatterned Wafers: the WM-3000 FOUP
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PETER-M. HEINZE, Macrotron Systems GmbH, München, Germany
ABSTRACT
Adefect detection tool utilising multiple beams at different wavelengths has been developed and acquired a proven track record in wafer fab utilities in Japan. The history of the development and the performance of the tool is described and its advantages over the conventional defect detector discussed.
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