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Encore for 300mm strip and RTP |
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Aug 08, 2006 at 04:27 PM |
 By Dr Mike Cooke
Mattson Technology announced follow-on orders for its Aspen III ICPHT strip and Helios rapid thermal processing (RTP) systems from two major Taiwanese memory manufacturers. The tools will be used in these chipmakers' latest 300mm fabs for the production of advanced dynamic random access memory (DRAM) devices through the 70nm technology node. The systems began shipping in June of this year and the orders will be completed by the first quarter of 2007.
The strip systems feature proprietary inductively coupled plasma (ICP) source technology. The RTP applications include nickel silicide formation and ultra-shallow junction spike anneals, enabled by advanced model-based temperature control.
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