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14th Edition: The Industry Transition to Single Wafer Thermal Processing |
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Feb 03, 2005 at 09:10 AM |
NOLAN KUAN, Applied Materials, Inc., Santa Clara, CA, USA
ABSTRACT
Today, in addition to technical drivers, there are strong economic
drivers in the semiconductor market for the use of single wafer thermal
processing tools, the primary driver being cycle time reduction.
Shorter product life cycles, decreasing technology adoption cycles, and
increasing time-to-market pressures require decreased development and
production cycle times. As semiconductor manufacturers transition from
200mm to 300mm wafers, they are choosing single-wafer toolsets to
deliver the technological and productivity benefits their products
demand.
 The Industry Transition to Single Wafer Thermal Processing
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Wafer Processing 
