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14th Edition: Surface Preparation Technology Requirements, Challenges, and Proposed Solutions |
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Feb 02, 2005 at 05:52 PM |
JAGDISH PRASAD & M. RAO YALAMANCHILI, SCP Global Technologies, Boise, ID, USA
ABSTRACT
In this paper we present results of the surface preparation processes
developed specifically to meet the ITRS requirements outlined for
particles, watermarks, surface roughness and metallic contamination.
These processes include a) a dilute SC1 process with integrated rinse
(termed "SC1 Pro-Rinse") for improved surface roughness and particle
removal and b) a drying process (termed "GreenDry") with integrated
chemical injection and rinse steps for watermark free final rinsing and
drying. Results from these new surface preparation processes clearly
indicate that these new technologies not only meet ITRS requirements
but also help reduce ESH impact by reduction in DI water consumption.
 Surface Preparation Technology Requirements, Challenges, and Proposed Solutions for Future Semicondu
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Wafer Processing 
