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14th Edition: Copper Removal Processes for Microelectronics Applications |
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Feb 02, 2005 at 05:48 PM |
RAJIB AHMED, BRIAN SOPKO & JACOB JORNE, University of Rochester, Rochester, NY, USA
ABSTRACT
Methods of copper removal for microelectronics applications have been
explored. We have discussed the mechanisms of the more commonly
accepted chemical mechanical planarisation (CMP) processes. We also
have investigated the mechanisms of electrodissolution and
electropolishing. Two processes for improving the current methods of
dual damascene copper processing have been made.
One utilises a synergy
between CMP and electrodissolution. The other uses electrodissolution
as an alternative to bulk copper removal and planarisation. Both merit
further investigation and experimentation to determine their viability
as accepted alternatives to current copper CMP removal processes.
 Copper Removal Processes for Microelectronics Applications
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Wafer Processing 
