Online information source for semiconductor professionals
Copper Removal Processes for Microelectronics Applications
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
ABSTRACT
Methods of copper removal for microelectronics applications have been explored. We have discussed the mechanisms of the more commonly accepted chemical mechanical planarisation (CMP) processes. We also have investigated the mechanisms of electrodissolution and electropolishing. Two processes for improving the current methods of dual damascene copper processing have been made. One utilises a synergy between CMP and electrodissolution. The other uses electrodissolution as an alternative to bulk copper removal and planarisation. Both merit further investigation and experimentation to determine their viability as accepted alternatives to current copper CMP removal processes.
 |
Please login to download the paper. No account yet? Please register. It's free! |