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Tool order: Korean memory maker orders tools for 300mm fab in China |
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Jul 15, 2006 at 03:13 PM |
 A "major" Korean memory manufacturer is ordering equipment for a new 300mm fab in China from Mattson Technology. The fab is believed to be the Hynix/STMicroelectronics Joint Venture facility in Woxu Province, China that whas announced last year and will be the second 300mm fab operating in China. The multi-system orders include a series of Aspen III ICPHT strip, Aspen III LiteEtch and Helios RTP systems to be used in front- and back-end-of-line applications to produce advanced DRAM (dynamic random access memory), SDRAM (synchronous DRAM) and Flash memory devices at 90nm and below. System shipments have already begun and are scheduled through the third quarter of this year.
"We are very pleased by the continuous trust in Mattson products shown by this leading memory manufacturer, who has again selected our systems for the process of record (POR)," said Stephen T. Lanza, Global Business Operations vice president and general manager for Mattson Technology. Lanza added: "Our systems' on-wafer results, low cost-of-ownership (COO) and high reliability, combined with Mattson's excellent service and support, will enable this customer to successfully meet its aggressive production ramps and transition to the 65nm node to quickly bring its most advanced devices to the global semiconductor market." By Dr Mike Cooke
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