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14th Edition: Automated Online Control of Plating Bath Additives Increases Wafer Yield |
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Feb 02, 2005 at 05:46 PM |
PETER BRATIN, GENE CHALYT & MICHAEL PAVLOV, ECI Technology, East Rutherford, NJ, USA
ABSTRACT
A new generation of online analysers of Damascene copper deposition
plating solutions based on cyclic voltammetric stripping (CVS) can
provide substantial yield improvements. The tight process window
typically required for void-free filing of submicrometre high aspect
ratio structures makes it important that additives be kept within a
tight range. This problem has been addressed by new online analytical
systems that sample plating tanks on a regular basis and determine the
rate at which chemicals in the plating tool need to be replenished.
The
instrument sends a signal to the plating tool or dosing unit that
automatically delivers the required additive components. The result is
a closed loop system that maintains the process window within the
strict limits required for high-yield Damascene plating.
 Automated Online Control of Plating Bath Additives Increases Wafer Yield
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Wafer Processing 
