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Cabot acquires IBM CMP slurry patents |
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Jul 05, 2006 at 04:05 PM |
 Chemical mechanical planarization (CMP) specialist Cabot
Microelectronics has entered into a patent assignment agreement with
IBM to acquire a number of patents and associated rights relating to
slurry technology, including various applications such as copper,
copper barrier, tungsten, and dielectrics, among others.
William P. Noglows, Cabot Microelectronics'
Chairman and Chief Executive Officer, comments: "For almost twenty years, since
the early days of CMP technology, we have had a productive and collaborative
relationship with IBM as an important customer, and we believe that this
acquisition of CMP slurry patents reflects and furthers this positive
relationship and our ability to bring value to all of our customers."
By Dr Mike Cooke
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News 
