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Tool Order: Two major U.S. MEMS manufacturers install Eco-Snow Systems’ cleaning tools

08 July 2008 | By Síle Mc Mahon | News > Wafer Processing

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VersaCleanEco-Snow Systems, an affiliate of The Linde Group, has announced the installation of two of its cleaning systems at two U.S.-based MEMS manufacturers. The Eco-Snow VersaClean system, used for cleaning of packaging components, and the Eco-Snow WaferClean system for released device level cleaning prior to wafer dicing, were recently installed at the two unnamed MEMS companies.

 

 

 

                          By Síle Mc Mahon

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