Eco-Snow Systems, an affiliate of The Linde Group, has announced the
installation of two of its cleaning systems at two U.S.-based MEMS
manufacturers. The Eco-Snow VersaClean system, used for cleaning of
packaging components, and the Eco-Snow WaferClean system for released
device level cleaning prior to wafer dicing, were recently installed at
the two unnamed MEMS companies.
By Síle Mc Mahon