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Bosch to build new 200mm fab in Reutlingen, Germany |
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Jun 19, 2006 at 06:12 PM |
 The Bosch Group is investing some 550 million euros in the construction of a 200mm fab at its manufacturing complex in Reutlingen, Germany. Construction is expected to start in the autumn of 2007 with production planned for mid-2009. The fab is expected to have a capacity of 30,000wspm when fully utilized and generate around 800 new jobs, according to the company.
"In investing heavily in state-of-the-art manufacturing technology, we are securing the long-term future of our international automotive electronics business," said Franz Fehrenbach, chairman of the Bosch Board of Management. The new fab will be responsible for Bosch's leading-edge automotive semiconductors built on its ‘smart power process' starting at the 350nm node but will be responsible for the migration of the process down to the 180nm node over time. MEMS devices will also be migrated to 200mm wafers at some stage in the future.
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