Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Materials & Gases arrow Soitec acquires LETI spin-off for layer transfer technology
Soitec acquires LETI spin-off for layer transfer technology Print E-mail
Jun 08, 2006 at 10:10 AM
SOI CleanroomSoitec has acquired TraciT Technologies, a company based close to Soitec in Grenoble, France and a spin-off start-up from CEA-Leti also located in Grenoble. According to Soitec, TraciT Technologies was on the verge of starting customer production. Financial details of the deal were not disclosed.

Dr Bernard Aspar, CEO of TraciT Technologies had previously worked at LETI where he developed the Smart-cut process with SOITEC for SOI wafers and had led the laboratory there.

TraciT Technologies had spun-off to commercialize thin-film layer transfer technologies that leverage molecular adhesion and mechanical, as well as chemical, thinning processes for the production of micro-electro mechanical (MEMS) and power circuits.

"The proximity and complementary nature of TraciT Technologies' activities on advanced materials and the similarity of our corporate cultures are reassuring our strategic interest of a merger, which will help drive the acceleration of promising development of TraciT Technologies inside the Soitec Group," said Andre-Jacques Auberton-Herve, president and CEO of the Soitec Group.


Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
IMEC and AIXTRON demonstrate AlGaN/GaN structures on 200mm silicon wafers  (03/06/2008)
Soitec plans global expansion and new research  (07/07/2006)
Tool order: LETI installs FEI’s Titan S/TEM microscope in new R&D facility  (16/05/2006)
Tool Orders: CEA Leti installs a Semitool Raider single wafer cleaning system  (16/12/2005)
Soitec and AS International fabricate 300-mm strained SOI substrates  (04/02/2005)

Related jobs
Process Engineers  (Balzers , 06/06/2008)
Development Engineers Power-Semiconductor Devices and Power-Modules  (Reutlingen, 19/05/2008)
Engineering Project Manager  (Alzenau, 28/03/2008)
Manager, Facilities and Support Services  (PERRYSBURG, 19/03/2008)
Site Director & GM  (South West UK, 06/03/2008)
Blog
Download
Subscribe
300mm