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Tool Order: Hoya selects Applied Materials Tetra II mask etcher for 65nm PSM |
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Jun 05, 2006 at 02:50 PM |
 Hoya Corporation has selected Applied Materials ‘Tetra II' Mask Etch system for the manufacturer of leading edge photomasks for both mask binary and phase shift mask (PSM) applications at the 65nm node. The tool is scheduled for installation at Hoya in mid-2006 at its facility in Hachioji, Japan.
"The Applied Tetra II system's exceptional 65nm mask etch capabilities, especially its chrome and quartz etch performance on the latest binary and phase shift mask applications, were key reasons for our purchase of this system," stated Asao Shikata, Chief General Manager, Mask Division of Hoya. "This system will help Hoya continue to provide the industry's most advanced masks over the next several generations of photomask technology."
"The Tetra II system is being used by the majority of 65nm-generation mask makers worldwide," stated Tom St. Dennis, senior vice president and general manager of Applied Materials' Etch, Cleans and Front End Products Group. Its best-of-class process technology also enables customers to easily create high precision, highly uniform mask patterns with the most advanced resolution enhancement techniques."
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