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Toshiba to construct large 200mm fab |
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May 31, 2006 at 10:16 AM |
 Toshiba Corporation has officially announced that it will begin construction of a new 200mm fab in Ishikawa Prefecture., Japan on the site of its Kaga Toshiba Electronics campus that is responsible for power and other discrete semiconductor manufacturing.
Construction of the fab will start in September 2006, and should be ready for tool installation in July 2007. Production is expected to start by September 2007. The new fab has a planned capacity of 60,000wspm, making it one of the largest 200mm fabs to be built with a cleanroom of approx. 8,000 square meters.
The fab will also be the largest 200mm fab dedicated to power devices and is intended to enable Toshiba to retain high margins and expand its market share in that sector. Power devices have traditionally been fabricated on smaller wafer sizes with few chip manufacturers yet to have switched production to 200mm wafers.
The majority of 200mm tools required for the new fab will come from Yokkaichi and other Toshiba fabs as well as the purchase of tools outside the group, though it was not stated whether that included the purchase of new tools. Investment in the new fab will stretch over 5 years at a cost of approximately $450 million US dollars, Toshiba stated.
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