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New Product: Alternative to hydroxylamine based resist etch residue remover |
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May 24, 2006 at 03:38 PM |
 Product Briefing Outline: Mallinckrodt Baker has introduced its ‘ALEG-380' photoresist stripper and residue remover as a cost-effective alternative to hydroxylamine-based chemistries in aluminum IC manufacturing processes. ALEG-380 is 100% water-soluble formulation that does not require an intermediate rinse, helping fabs improve yields and reduce manufacturing costs.
Problem: Hydroxylamine may explode on heating therefore requires lower process operating temperatures. Bath life and metal corrosion issues have arisen as chip manufacturers implement cost reduction strategies for mature processes.
Solution: ALEG-380 photoresist stripper and residue remover is particularly efficient on ash residues with high titanium content, the company claims. The chemistry is designed to provide protection against galvanic corrosion associated with device architecture containing complicated metal stacks. It can be used as a one-step chemistry in traditional semiconductor processes containing aluminum and silicon dioxide layers, as well as in back-end packaging processes, including flip chip and bump applications. The formulation is designed to be easily integrated into processes that have traditionally used hydroxylamine- and fluoride-based chemistries. It provides broad process latitude in terms of processing time and temperature, with results seen in 5-20 minutes. Typical bath life of ALEG-380 photoresist stripper and residue remover is longer than 24 hours, according to the company.
Applications: Bulk photoresists, heavily cross-linked ash/etch residues, and sidewall polymers in aluminum manufacturing processes. Can also be used in back-end packaging processes, including flip chip and bump applications.
Platform: ALEG-380 is 100% water-soluble formulation that does not require an intermediate rinse. Typical bath life is longer than 24 hours.
Availability: May 2006 onwards.
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Product Briefings 
