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TSMC in production with low-power 65nm process |
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May 17, 2006 at 05:11 PM |
 Taiwan Semiconductor Manufacturing Company (TSMC) has stated that it has fully qualified its low-power 65nm process and is being ramped to volume production levels for several devices.
"TSMC again leads the industry in pushing Moore's law to the 65 nanometer generation," said Dr. Rick Tsai, President and Chief Executive Officer, TSMC. "At 65nm geometries, we can produce highly integrated, very small and low power devices for every conceivable market. Producing on our advanced 300mm wafers, we can ramp customers' design to high volume quickly. It provides unprecedented opportunities for customers to further advance the leadership positions in their marketplaces."
TSMC's 65nm generic process utilizes a 9-layer metal process with core voltages of 1.0 or 1.2 volts, and I/O voltages of 1.8, 2.5 or 3.3 volts, according to the company.
(Photo source:Taiwan Semiconductor Manufacturing Company Co Ltd. Internal cleanroom 300mm fab)
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