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SMIC building 300mm fab in Shanghai |
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May 12, 2006 at 10:53 AM |
 Semiconductor Manufacturing International Corp (SMIC) the third largest pure-play foundry by revenues is currently constructing a second dedicated 300mm fab located at its cluster of 200mm facilities in Shanghai. The facility is expected to be completed by the end of 2006 with tool install expected in 1Q07.
Currently SMIC operates one 300mm facility in Beijing, the first 300mm facility in operation in China. The foundry expects to spend $1.1 billion US dollars on capital expenditure in 2006 with an estimated $200mm allocated to the construction and cleanroom installation of the new fab in Shanghai.
A large proportion of the budget is expected to be allocated to further ramping its 300mm fab in Beijing, Fab4 to around 26,000wspm, according to news reports from Chinese newspapers.
This would indicate that Semiconductor Fabtech's ‘300mm Activity Report' analysis that Fab4 would be ramped by another 10,000wspm by the end of the year would be correct as SMIC projected 2Q06 wafer starts would reach over 14,000wspm in that time frame.
The majority of production at Fab4 is dedicated to DDR2 DRAM for Infineon on its 110nm process but is being migrated to 90nm by the 2HO6 period.
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