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29th Edition: 300mm Report December 05 to March 06 |
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May 09, 2006 at 09:07 AM |
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
The wave of 300mm fab activity that started in the 3Q05 has continued through to the 1Q06 creating the fifth such wave since 300mm fabs began being constructed. The current wave is expected to continue through to the 1H07 period with at least 15 300mm fabs entering tool install phases in an 18 months cycle. The continued fab expansions in the Asia-Pacific and in particular Taiwan are investigated as well as the key issue concerning the potential for over-capacity in both DRAM and NAND Flash memory as these companies are becoming increasingly aggressive with new fab projects. For the first time we analyse in detail the changing capacity dynamics of major chip manufacturers juggling both DRAM and NAND production. We also return to cover the capacity ramps of Intel's 300mm fabs and update on the ongoing developments in the pure-play foundry space.
29th Edition: 300mm activity report: December 2005 to March 2006
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300mm Activity Reports 
