At the 200mm fab level, some of TSMC's fabs are already at full capacity and not expected to increase output in 2006. Wafertech, TSMC's only fab in North America is already at full capacity (33,000wspm) and will squeeze only several hundred more wafer starts per month by the end of the year. Fabs 3 and 5 are virtually full, being able to squeeze a few thousand more wafers out over the coming year. Fab 3 is currently producing 45,000wspm and will rise to 49,666wspm by the end of 2006, reaching capacity. Fab 3 is in a similar position with 82,000wspm in 1Q06 and only able to squeeze that up by 2,000wspm by 4Q06.

The biggest ramp rise with respect to 200mm fabs will come from TSMC's fab in Shanghai, China. There the fab will go from 16,000wspm in 1Q06 to 27,333wspm in 4Q06. The only other noticeable rise in capacity will come from Fab 6 in Tainan, Taiwan. Originally built as 300mm capable the fab had a ‘official' capacity of 60,000wspm. However last year it past 70,000wspm and is now projected to reach 80,333wspm by 4Q06!

TSMC's two 300mm facilities as expected are being further ramped this year. Fab 12, TSMC's first 300mm facility reached 47,333wspm in 1Q06 and is expected to reach 54,000wspm by year-end, a 7,000wspm increase. This could actually be that fabs capacity ceiling.

The biggest ramp of any of TSMC's fabs is coming from Fab 14, its second 300mm facility. Fab 14 is currently at 20,333wspm and is expected to reach 38,333wspm by 4Q06, an increase of 18,000wspm.

TSMC also reiterated that its capital expenditure plans are unchanged from previous guidance given late last year, standing at $2.6 to $2.8 billion US dollars. The company spent $344 million on CapEx in 1Q06. The majority of CapEx is being allocated to ramping its 300mm facilities in 2006.