Renesas Technology Corp has ordered multiple ‘Tachyon' RDI lithography simulation and design inspection systems from Brion Technologies as part of its strategy to introduce IC devices at the 65nm node in faster time-to-production than previous nodes.
"As we implement our 65nm process flows, we're finding that Brion's model-based, full-chip OPC verification platform offers a critical, enabling capability. In fact, we see major benefits in using Tachyon RDI as a sign-off tool before ordering photomasks to minimize the risk of costly yield hits due to defects," said Dr. Masao Nakaya, Executive General Manager of LSI Product Technology Unit at Renesas Technology Corp. "Tachyon RDI's performance and model accuracy gives us a production-worthy method of predicting these errors and preventing failures in LSI manufacturing." "More and more, we're seeing device makers around the globe and especially in the Japan market make model-based OPC verification a sign-off requirement before designs are put into production," said Noriaki Kikuchi, president, Japan operations, Brion Technologies KK. "This is an important trend that underscores the significance of Tachyon technology, which delivers the acute accuracy required by the fast-growing OPC verification market." According to Bryon, the success of the Tachyon platform has led to the introduction of its ‘OPC+,' which extends Brion's OPC verification technology to the critical OPC implementation market.
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