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Silterra plans foundry ramp to 40,000wspm by year end |
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Apr 11, 2006 at 03:46 PM |
 Silterra Malaysia Sdn. Bhd has announced that it plans to increase capacity in 2006 to meet customer demand from 130nm through to the 160nm node. The foundry expects to increase 200mm wafer starts from the current 33,500wspm to 40,000wspm by the end of 2006, which completes Fab 1 capacity expansion program, according to the company.
"We anticipated the increase in customer demand and expanded our capacity accordingly," stated Bruce Gray, Chief Executive Officer of Silterra. "Even with the added capacity, our fab utilization rate is over ninety-five percent right now. Our plan is to build out the fab to the maximum capacity of 40,000 wafer starts per month with state-of-the-art 0.13-micron equipment by year end. We are ramping up volume on the 0.16-micron node, which will contribute to our revenue significantly for the rest of the year. The present indications are that Silterra's business level in 2006 will be considerably above that of 2005."
The main expansion program will be allocated to ramping its copper CMOS 130nm process. Its mask shrink only 160nm process is ramping for several consumer devices, while its 180nm copper process is currently at full production. Silterra started production at Fab 1 six years ago in 2000.
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