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Home arrow Wafer Processing arrow Articles arrow Edition 15 arrow 15th Edition: Silicon Epitaxy: Tomorrow’s Solution Today
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15th Edition: Silicon Epitaxy: Tomorrow’s Solution Today Print E-mail
Feb 02, 2005 at 04:21 PM
ROBERT ROYALTY, GlobiTech Inc., Sherman, TX, USA

ABSTRACT

This article aims to provide a quick view of silicon epitaxial deposition processes, recent advances in epitaxy, and market projections for 300 mm and 200 mm technologies. Single-wafer systems are replacing batch systems for performing epitaxial deposition. The advantages of epitaxial silicon over polished wafers are outlined. Advances in single-wafer epitaxial processes have been made that allow cost improvements, improved layer uniformity and lower defect densities. A forecast of future demand for Epi silicon is examined; a substantial increase is predicted.
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