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15th Edition: Tool-Level APC |
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Feb 02, 2005 at 04:17 PM |
MERRITT FUNK, RADHA SUNDARARAJAN & KEVIN LALLY, TEL, Austin, TX, USA
ABSTRACT
Advanced
process control (APC) is rapidly being implemented in selected areas of
fab operations. It has the potential to reduce costs, increase
productivity and enhance the value of the product. A simple single
level of control will not be sufficient to meet the complex demands of
a semiconductor fab. Some of the functionality will reside at the
process tool level. This article discusses the integral components of
the foundation for tool-level APC. The foundation must be correct to
allow scalability to meet future requirements. Some of the challenges
for future cooperation between IC manufacturers and equipment
manufacturers are identified.
 10 - Tool-Level APC
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Wafer Processing 
