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Tool Order: US IC manufacturer places multiple orders for Rudolph’s bevel-edge defect tool |
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Mar 30, 2006 at 12:45 PM |
 A Top-Ten U.S. based semiconductor manufacturer has placed a multiple tool order with Rudolph Technologies for its recently launched ‘E25' Wafer Edge Inspection System that includes frontside, backside and now complete bevel-edge defect inspection. The system is used to classify and correlate macro defects the deposition, CMP, etch and lithography steps.
"Inspecting the edge and backside regions offers new opportunities for existing fabs to dramatically increase yield on their established processes," said Ardy Johnson, Rudolph's vice president of marketing. "Manufacturers are now learning that as much as 30 percent of killer defects come from these areas. For instance, films can wrap around the edge and accumulate in layers that eventually flake off, only to be re-deposited on the frontside of the wafer."
According to the company the customer is using Rudolph's all-surface inspection platform to qualify incoming tools for their newest fab.
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